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The purpose of PCBs board detection is to find out the defects of PCBs board and repair them, so as to ensure the production quality of the board and improve the quality rate of the product.
At present, PCB inspection methods can be divided into two categories: electrical inspection methods and visual inspection methods. Here are 5 common PCB inspection methods.
Manual visual inspection of PCBs is the most traditional detection method. Visual inspection with a magnifying glass or microscope Calibrated PCBs are used to evaluate whether a PCB is acceptable and to determine when corrective action is required.
The disadvantages of manual visual inspection are human error, high long-term costs, intermittent fault detection, and difficult data collection. As PCB production increases and lead spacing and component volume on the PCB decrease, manual visual inspection methods become less and less feasible.
AOI uses a 2D camera or two 3D cameras to take pictures of your PCB. The program then compares your board photos to a detailed schematic. If a board doesn't match the schematic to a certain degree, it's flagged for inspection by a technician.
Semiki Machine Vision Checks and Detects Defects on Products Using Machine Vision With High Accuracy
This test involves the use of fixed probes that are arranged in a manner consistent with the PCB design. The probes test the integrity of the solder connection. A Jig/fixture is used to secure the PCB and a push-in operation is used to initiate the test. There are pre-designed access points in the board that allow the IT test probes to make a connection to the circuit. They apply a certain amount of pressure to the connection to ensure it remains intact.
4, Functional Circuit Test (FCT)
Functional circuit testing is exactly what it sounds like – it tests the functionality of the circuit. This type of testing is always performed at the end of the manufacturing process, using a functional tester to check that the finished PCB operates according to specifications.
Functional testers come in many varieties, but they generally share a common function – they simulate the final environment in which the PCB is intended to operate. Functional testers typically do this by interfacing with the PCB through its test probes or edge connectors and testing to confirm that the PCB operates according to its design specifications.
X-ray inspection can examine components that are normally hidden from view, such as ball grid array interconnects and packages that have solder joints underneath the chip package. While this inspection can be very useful, it requires a trained and experienced operator.
A specific example of how X-rays are used is in ball grid array (BGA) inspection. A BGA is a surface mount device that uses a series of metal balls made of solder to make connections. This type of device is popular because it allows for high-density connections without complicating the PCB layout. However, the difficulty with BGAs is that the connections are made on the underside of the BGA chip. This feature, as well as the density of the solder balls, makes it difficult to solder and desolder and increases the likelihood of solder bridges forming. This location also makes BGA chip solder joints particularly difficult to inspect. X-rays simplify the inspection process by allowing the user to see the solder joints underneath, making bridges easier to identify.
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