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Force and mechanical measuring equipment
HAKKO FR150 series Highest quality solder wick used by professionals
Using halogen-free flux leaves less flux residue after solder removal and is less corrosive, achieving high solder removal efficiency and reliability.
Application:
Solder desoldering wire is used to remove solder from elemental devices or from patterns on printed circuit boards (PCBs) from which surface mount devices such as BGAs (ball-grid arrays) have been removed.
Faster heat transfer for superior performance at lower temperatures and with lower wattage soldering irons.
HAKKO Desoldering Wire no clean type
Faster thermal transmission for superior performance at lower temperature and with lower wattage soldering irons.
Hakko FR150-86
Usage/Applications
Desoldering wire is used to remove solder from an elemental device or from patterns on a printed circuit board (PCB) from which surface-mounted devices such as BGA (ball grid array) have been removed.
Place the desoldering wire on where you want to desolder, and put a soldering iron on top to melt a solder joint.
Once the desoldering wire sucks away molten solder, take the wire and iron off the board at the same time.
[HAKKO WICK] How to use the wick correctly
FR150-81 : 0.7mmX1.5m
FR150-82 : 1mmX1.5m
FR150-83 :1.5mmX1.5m
FR150-84 :2mm x 1.5m
FR150-85: 2.5mmX1.5m
FR150-86 :3mm x 1.5m
FR150-87: 2mmx2m
FR150-88: 2.5mmx2m
FR150-89: 3mmx2m
Pic.: HAKKO Desoldering Wire WICK no clean type FR150-88 (2.5mmx2m) at Semiki's warehouse
Pic.: HAKKO Desoldering Wire WICK no clean type FR150-87 (2mmx2m) at Semiki's warehouse
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Semiki instrumentation Co., Ltd
Email: sales@semiki.com
Office tel: +84 979761016
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